Publié le 07/02/2018
Materials chosen for PCB and device assembly must deliver optimum reliability and durability in today’s challenging automotive, lighting and industrial applications.
Heat is typically seen as the enemy and thermal management challenges exist across a wide variety of applications and may require specific solutions. Choosing a solution is driven by both the module/device design and the operating conditions. Ideally, the right choice should not only help to achieve desired thermal management characteristics but also support cost, process and/or design optimization.
As a class of materials, silicones are consistently reliable at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, silicone products can help expand design and manufacturing options.
Dow’s industry-leading portfolio of innovative, thermally conductive silicone adhesives, compounds, encapsulants, greases, gap fillers and dispensable pads can provide a thermal management solution for the most sensitive circuits and components.
source : prospector.com