Dow Corning Launches Two New Silicones

In order to meet ever-increasing demand for thermal management solutions, Dow Corning, a global leader in silicones, has launched two new thermal management compounds:

 Dow Corning TC-5622 is a silicone compound with a thermal conductivity of 4.3 W/mK. More information is available in the technical data sheet.

 Dow Corning TC-5351 is a silicone compound with a thermal conductivity of 3.3 W/mK. More information is available in the technical data sheet.

These compounds achievethin bond line thicknesses (BLTs) to ensure low thermal resistance. The heat sinks used must be mechanically fastened.

For more information:

Thermal Management Brochure