Dow Corning Launches Two New Silicones
In order to meet ever-increasing demand for thermal management solutions, Dow Corning, a global leader in silicones, has launched two new thermal management compounds:
Dow Corning TC-5622 is a silicone compound with a thermal conductivity of 4.3 W/mK. More information is available in the technical data sheet.
Dow Corning TC-5351 is a silicone compound with a thermal conductivity of 3.3 W/mK. More information is available in the technical data sheet.
These compounds achievethin bond line thicknesses (BLTs) to ensure low thermal resistance. The heat sinks used must be mechanically fastened.