HERAEUS F 360

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Applications
Microbond Product line for Automotive et Industrie
Caracteristics
Ag3,5-89L25 / Alloy Ag3,5 / 89% Metal content / Viscotity L : Dipping - Jetting grade / Powder type : 2.5 / Particle Size: 25 - 75 µm / Melting Point : 221°
Property
Lead free solder paste, Application : Power electronic, No clean, printing process
Dangerous. Observe safety precautions - For professional use only
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Variations

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Name Code article Price Availability
HERAEUS F 360
500 g Jar
HRF360A Contact us

Caracteristics

Alloy Sn96.5/Ag3.5
Application Methode Printing
Type de poudre Type 2.5
Brand HERAEUS
Product's associated market Electronics
Halogen Yes / Free / Zero Halogen zero
Flux Type No Clean

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