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DOWSIL™ TC-4535 CV

Applications

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 3,4W/m.K with glass bead to help control the thickness

Caracteristics

Blue / Mix ratio 1:1 / Thixotrope / Thermal conductivity : 3,4 W/m.K / Hardness : Shore 00 52 / Working time : 60min / Cure time : 2h30 at 25°C or 30 min at 80°C / Dielectric strength : 22 KV/mm

Property

Two-part Silicone RTV (2h30) & heat accelerable, 1:1 mix, gap filler with low hardness and a low thermal resistance, UL 94 V-0

Dangerous. Observe safety precautions - For professional use only

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Variations

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Name	Code article
DOWSIL™ TC-4535 CV 2 kg Kit	DETC4535K2KG	Contact us	DownloadDownload the technical datasheet
DOWSIL™ TC-4535 CV 40 Kg Kit	DETC4535K40	Contact us	DownloadDownload the technical datasheet
DOWSIL™ TC-4535 CV 50 ml Cartridge	DETC4535K50	Contact us	DownloadDownload the technical datasheet

Caracteristics

Application Methode	Automatic
Curing Type	Room Temperature Curing
Certification / Specification	UL 94 V0
Chemistry / Technology	Silicon
Brand	DOWSIL
Product's associated market	Electronics, E-Mobility
Color	Blue
Hardness Class	Gel (40 - 80 Shore 00 / 0 - 5 Shore A)
Hardness	52 00shore
Electric Properties	Electrically Insulating
Number of Component	Bi Componant / 2 Parts
Maximum temperature (°C)	150 CELSIUS
Minimum temperature (°C)	-45 CELSIUS
Thermal Conductivity (W/m⋅K)	3.4 WmK
Thermal Management Solution	Gap Filler
Dynamic Viscosity (25°C)	205000 mPas