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DOWSIL™ TC-4525

Applications

DOWSIL™ TC4525, formerly DOW CORNING™ TC4525, is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 2.5W/m.K

Caracteristics

Blue / Mix ratio 1:1 / Thixotrope / Thermal conductivity : 2.5W/m.K / Thermal resistance at 115µm : 0.73°C/W / Hardness : Shore 00 55 / Working time : 40min / Cure time : 2h at 25°C ou 20 min at 50°C / Dielectric strength : 18 KV/mm

Property

Two-part Silicone RTV (2h) & heat accelerable, 1:1 mix, gap filler with low hardness and a low thermal resistance, UL 94 V-0 Download chemical equivalency certificates by clicking on the Homologation link opposite.

Dangerous. Observe safety precautions - For professional use only

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Variations

This product is not available online.Contact us

Name	Code article	Price					Availability
DOWSIL™ TC-4525 50 ml Cartridge	DETC4525K50		Contact us
DOWSIL™ TC-4525 40 kg Kit	DETC4525-40		Contact us

Caracteristics

Application Methode	Automatic
Curing Type	Room Temperature Curing
Certification / Specification	UL 94 V0
Chemistry / Technology	Silicon
Brand	DOWSIL
Product's associated market	Electronics, E-Mobility
Color	Blue
Hardness Class	Gel (40 - 80 Shore 00 / 0 - 5 Shore A)
Hardness	40 00shore
Electric Properties	Electrically Insulating
Number of Component	Bi Componant / 2 Parts
Maximum temperature (°C)	150 CELSIUS
Minimum temperature (°C)	-45 CELSIUS
Thermal Conductivity (W/m⋅K)	2.5 WmK
Thermal Management Solution	Gap Filler
Dynamic Viscosity (25°C)	217000 mPas