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DOWSIL™ TC-4515

Applications

DOWSIL™ TC4515 formerly DOW CORNING® TC4515, is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 1.5W/m.K

Caracteristics

Blue / Mix ratio 1:1 / Thixotrope / Thermal conductivity : 1.5W/m.K / Thermal resistance at 125µm : 1.73°C/W / Hardness : Shore 00 55 / Working time : 60min / Cure time : 2h30 at 25°C or 30 min at 80°C / Dielectric strength : 15,8 KV/mm

Property

Two-part Silicone RTV (2h30) & heat accelerable, 1:1 mix, gap filler with low hardness and a low thermal resistance, UL 94 V-0 Download chemical equivalency certificates by clicking on the Homologation link opposite.

Dangerous. Observe safety precautions - For professional use only

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Variations

This product is not available online.Contact us

Name	Code article
DOWSIL™ TC-4515 40 kg Kit	DETC4515-40	Contact us
DOWSIL™ TC-4515 50 ml Cartridge	DETC4515K50	Contact us
DOWSIL™ TC-4515 40 OZ KIT (SEMCO 20OZ*2)	DETC4515	Contact us

Caracteristics

Application Methode	Automatic
Curing Type	Room Temperature Curing
Certification / Specification	UL 94 V0
Chemistry / Technology	Silicon
Brand	DOWSIL
Product's associated market	Electronics, E-Mobility
Color	Blue
Hardness Class	Gel (40 - 80 Shore 00 / 0 - 5 Shore A)
Hardness	50 00shore
Electric Properties	Electrically Insulating
Number of Component	Bi Componant / 2 Parts
Maximum temperature (°C)	150 CELSIUS
Minimum temperature (°C)	-45 CELSIUS
Thermal Conductivity (W/m⋅K)	1.8 WmK
Thermal Management Solution	Gap Filler
Dynamic Viscosity (25°C)	240000 mPas