DOWSIL™ EG-3896

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Applications
Gel is suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
Caracteristics
2 part / Viscosity : 520 mPas / Hardness : Shore P30 / Clear / Dielectric Strength : 22 KV/mm / 30min at 70°C or 10min at 100°C
Property
Electronic silicone / Potting Gel / 2 parts / addition HTV / Low viscosity / Primerless / UL94 V-1
Dangerous. Observe safety precautions - For professional use only
See the different packaging

Variations

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Name Code article Price Availability
DOWSIL™ EG-3896
36 kg Kit
DEEG3896-36 Contact us

Caracteristics

Curing Temperature (°C) 70 CELSIUS
Curing Time (min) 30 MINUTE
Curing Type Hot Curing
Chemistry / Technology Silicon
Dielectric Strength (kV/mm) 22 kV_mm
Brand DOWSIL
Product's associated market Electronics
Color Clear
Hardness Class Gel (40 - 80 Shore 00 / 0 - 5 Shore A)
Electric Properties Electrically Insulating
Number of Component Bi Componant / 2 Parts
Maximum temperature (°C) 200 CELSIUS
Minimum temperature (°C) -45 CELSIUS
Dynamic Viscosity (25°C) 520 mPas