Heat-transfer Compound

Easy to use and non-curing, compounds are used for applications that require high thermal conductivity. They have low thermal resistance and are easy to remove for maintenance.

They require mechanical fastening to maintain their thickness, which is generally less than 50 microns.
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By brands

MOLYKOTE
ARALDITE
DOWSIL
KRYTOX
SILASTIC
SYLGARD
BOSTIK
PERMABOND
ELECTROLUBE
MERBENIT
XIAMETER
REN
DEVCON
SOCOMORE
DUNA CORRADINI
VOLTALEF
AIRTECH
SYNTHENE
TECTYL
OSIXO
HB FULLER
HERAEUS