Thermal management

As electronics become more and more powerful yet smaller and smaller, microchips and other electronic components generate increasing amounts of heat. Above a maximum operating temperature, heat can affect component performance and slow down or even damage devices. Thermal management is therefore a must for any electronic application.

Heat sinks must be used to dissipate this heat. The metal surfaces of these devices, even when polished, have a certain amount of roughness. Therefore, when a heat sink and a component are placed together, the contact is never 100% and there is an air gap between the two surfaces. The use of a thermal interface material between such gaps ensures complete contact between the two surfaces and in turn more efficient heat conductance.

Our complete range of thermal interface materials is covered in our Thermal Management Selector Guideand consists of various products for various applications:

•   Heat-transfer compounds
•   Thermal pads
•    Thermally conductive encapsulants
•   Thermally conductive adhesives: (One-part / Two-part

DOW CORNING ELECTRONICSand ELECTROLUBEare our preferred partners for thermal management solutions.