New thermally conductive silicone & New thermally conductive encapsulant/pottant dedicated for the electronic market
Dow CorningTM, the global leader in silicone technologies, completes its thermal management product range with the launch of a new adhesive, Dow Corning TC-1500 and a new encapsulant, Dow Corning TC-6020.
Dow Corning TC-1500 is a one part thermally conductive adhesive curing at room temperature (RTV) with a thermal conductivity of 1.55W/m.K and a short tack-free time.
Dow Corning TC-6020 is dedicated for the encapsulation (potting) applications and has a high thermal conductivity (2.72W/m.K). This new 2-part silicone encapsulant cures at room temperature but can be accelerated via heat cure (13 min at 80°C). Others properties : low viscosity (10.800mPa.s), high dielectric strength (24.1KV/mm), and its UL 94 V-0 certification, make this product suitable for applications where dielectric properties and thermal management are important features.