DOWSIL™ TC-5550 Thermally Conductive Compound
DOWSIL™ TC-5550 Thermally Conductive Compound, is a one-part silicone compound with high thermal conductivity (5.0 W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT (0.02 mm), specially designed for bare die applications due to its good pump-out resistance.
DOWSIL™ TC-5550 Thermally Conductive Silicone Compound. This combination promotes high thermal conductivity, low pump-out and high temperature stability.
The compound is designed to maintain the thermal seal of the heatsink to improve heat transfer from an electrical device or PCB system assembly to a heatsink or chassis, especially for consumer devices. The combination of these factors usually means that more heat is generated in the device.
Thermal management of PCB system assemblies is a major concern for design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device. In this regard, thermally conductive compound plays a critical role. Thermally conductive material acts as a thermal “bridge” to remove heat from a heat source (device) to the environment via a heat transfer medium (i.e., heat sink). This material has properties such as low thermal resistance, high thermal conductivity, and thin line of contact (BLT) thicknesses that can help improve heat transfer from the device. DOWSIL™ TC-5550 thermally conductive compound, has advantages over other thermal interface materials (TIMs) due to its anti-pump-out, ease of application to heat sinks (screen printing) and ease of reprocessing.
Technical features and benefits
DOWSIL™ TC-5550 Composé thermoconducteur :
- Good pump resistance for bare die applications
- No baking required
- Ensures material stability
- Easy application: screen and stencil printing
- High thermal conductivity
- Allows for a thin bond line thickness (BLT)
- Low thermal resistance
Applications
DOWSIL™ TC-5550 Thermally Conductive Compound is designed to provide efficient heat transfer for cooling electronic modules, as well as good resistance to pump-out, especially in bare chip applications.
In the video below, a detailed presentation of the main applications and features of DOWSIL™ TC-5550 Thermally Conductive Compound :
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Sources : www.dge-europe.com