DOWSIL™ TC-5150: A Thermally Conductive Gap Filler for Optimal Heat Dissipation

The DOWSIL™ TC-5150 Thermally Conductive Gap Filler is a high-performance, one-part, non-curing thermally conductive gap filler. With a thermal conductivity of 5 W/mK, this product, like other Dow™ silicone-based thermally conductive compounds, is manufactured using silicone heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity and ensures stability at high temperatures. These silicones are designed to provide a positive thermal seal, improving heat transfer from the electrical device to the heat sink or chassis, thereby increasing overall device efficiency.

Applications :

• On-board chargers: Ideal for dissipating heat from on-board chargers, ensuring optimal operation and extended lifespan.
• Central processing units (CPUs): Enables efficient heat dissipation from CPUs, preventing overheating issues and optimizing performance.
• Memory and power modules: Ensures proper thermal dissipation for memory and power modules, enhancing stability and reliability.
• Telecom base stations: Maintains optimal temperature in base stations, ensuring seamless operation of telecommunications equipment.
• Automotive Electronic Control Units (ECU): Provides efficient thermal management for vehicle electronic control units, enhancing performance and durability.
• Processors and microprocessors: Enables effective heat dissipation for processors and microprocessors, preventing overheating issues and maximizing efficiency.
• Power electronics: Ensures optimal thermal dissipation for power electronic components, improving stability and lifespan.
• Power supplies and semiconductors: Facilitates efficient thermal management for power supplies and semiconductors, guaranteeing reliable and stable operation.

Benefits:

• High thermal conductivity: Facilitates rapid and efficient heat dissipation, preventing overheating issues and improving electronic device performance.
• Easy application: Its convenient formulation allows for easy application of the gap filler, simplifying the installation process.
• Form-in-place: The gap filler adapts perfectly to available spaces, offering a customized and effective thermal management solution.
• No additional curing process required: The gap filler does not require an additional curing process, saving time and ensuring ease of use.
• Low thermal impedance: Minimizes thermal resistance, promoting optimal heat transfer and efficient dissipation.
• Repositionable: If repositioning or adjustments are needed, the gap filler can be easily repositioned without compromising its thermal performance.
• Room temperature storage: Can be stored at room temperature, providing flexibility in storage.

These combined benefits make the DOWSIL™ TC-5150 Thermally Conductive Gap Filler an ideal choice for engineers and manufacturers seeking an efficient and reliable thermal management solution for their electronic products.

Processing and Application Guidelines

The DOWSIL™ TC-5150 Thermally Conductive Gap Filler is a one-part, non-curing silicone material that can be used without additional curing steps and is reworkable. It exhibits excellent vertical hold behavior while allowing efficient automated dispensing due to its thixotropic nature.

Application Methods

One-part materials do not require mixing and can be applied as is with automated dispensing.

Useful Temperature Ranges

For most applications, silicone-based thermal materials, such as the DOWSIL™ TC-5150 Thermally Conductive Gap Filler, should operate reliably within a temperature range of -40 to 125 °C (-40 to 257 °F) for extended periods. However, at both low and high temperature extremes, the behavior and performance of the materials in specific applications may become more complex and require additional considerations. Factors that can influence performance include component configuration, stress sensitivity, cooling rates, hold times, and prior temperature history. At elevated temperatures, the durability of cured silicones is time and temperature dependent. As expected, the higher the temperature, the shorter the usable lifespan of the material.