Encapsulants

ELECTROLUBE ER2074 250 gr Bag

ELER2074RP250G

Epoxy resin for encapsulation and potting of PCBs, electrical connections, transformers and thermal collectors.
Two-part / Viscosity: 16700 cPs / Hardness: 80 Shore D / Temperature: -40°C to 130°C (-40°F to +266°F) /Thermal conductivity: 1.26 W/m K / 24 hrs at 23°C (73.4°F) or 4 hrs at 60°C (140°F)
Epoxy resin / Thermal conductivity / White / High level of flame retardancy / Non-abrasive fillers.
Dangereux. Respecter les précautions d'emploi