Thermal management 

As electronics become more and more powerful yet smaller and smaller, thermal management has become a necessity for all electronic applications. 

This section contains a number of thermal transfer materials: compounds, thermal pads, thermally conductive encapsulants (neutral silicone, epoxy, PU) and thermally conductive adhesives (used in place of mechanical fastening of heat sinks).

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ManufacturerNameApplicationPackaging

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

250 g Bag

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

25 kg Kit

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

5 kg Kit

Thermally conductive Oxime RTV

75 ml Seringe

Thermally conductive ethoxy RTV.

75 ml Seringe

Thermally conductive adhesive

20 ml Seringe

Silicone Heat Transfer Compound Plus.

50 ml Tube

Silicone Heat Transfer Compound Plus.

25 kg Drum

Silicone Heat Transfer Compound Plus.

10 kg Pail

Silicone Heat Transfer Compound Plus.

1 kg Can

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