Thermal management
As electronics become more and more powerful yet smaller and smaller, thermal management has become a necessity for all electronic applications.
This section contains a number of thermal transfer materials: compounds, thermal pads, thermally conductive encapsulants (neutral silicone, epoxy, PU) and thermally conductive adhesives (used in place of mechanical fastening of heat sinks).
This section contains a number of thermal transfer materials: compounds, thermal pads, thermally conductive encapsulants (neutral silicone, epoxy, PU) and thermally conductive adhesives (used in place of mechanical fastening of heat sinks).
By brands
