Silicone monocomposant 

Ces produits sont dédiés aux applications très basses températures, ou solution de micro-électronique comme la technologie glob-top ou la technologie dam & fill. Sont présents également des gels avec une polymérisation UV.

per page
ManufacturerNameApplicationPackaging

DOWSIL™ Q36611 Black formerly DOW CORNING® Q36611 Black, is used for bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors.

3.6 kg Drum

Dow Corning Q36611 Black is used for bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors.

204.1 kg Drum

Dow Corning Q36611 Black is used for bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors.

18.1 kg Drum

DOWSIL™ Q36611 Black formerly DOW CORNING® Q36611 Black, is used for bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors.

453 g Can

Dow Corning SE 9189L is used for module assembly / Parts fixing on circuit boards.

330 ml cartridge

Dow Corning SE 9189L is used for module assembly / Parts fixing on circuit boards.

20 kg Drum

Dow Corning SE 9189L is used for module assembly / Parts fixing on circuit boards.

120 g Tube

Dow Corning SE 9189L is used for module assembly / Parts fixing on circuit boards.

330 ml cartridge

Dow Corning SE 9189L is used for module assembly / Parts fixing on circuit boards.

120 g Tube

DOWSIL™ SE 9188 formerly DOW CORNING® SE 9188, is used for parts fixing on circuit boards, circuit boards of power supply modules.

330 ml cartridge

per page