Encapsulants 

Standard filled encapsulants provide thermal conductivity and have low viscosity for rapid part filling without bubbles. 

Encapsulants allow heat to be removed from components to metal housings, which serve as heat sinks.

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ManufacturerNameApplicationPackaging

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

226.7 kg Drum B

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

5.4 kg Drum A

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

24.9 kg Drum A

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

226.7 kg Drum A

Résine Epoxy thermoconductrice pour encapsulation ou résinage des circuits imprimés, alimentations électriques, transformateurs et capteurs thermiques

5 kg Kit

Résine Epoxy thermoconductrice pour encapsulation hautes températures (potting)

5 kg Kit

Résine Epoxy thermoconductrice pour encapsulation hautes températures (potting)

250 g Bag

Encapsulant silicone thermoconducteur

2 kg Kit

Encapsulant silicone thermoconducteur

30 kg Kit

Encapsulant thermoconducteur version basse viscosité du TC4605

10 kg Kit

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