Encapsulants 

Standard filled encapsulants provide thermal conductivity and have low viscosity for rapid part filling without bubbles. 

Encapsulants allow heat to be removed from components to metal housings, which serve as heat sinks.

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ManufacturerNameApplicationPackaging

Thermally conductive encapsulant.

A 1 kg Bottle

Sylgard® Q33600 is a Thermally conductive encapsulant for highvoltage transformers.

60 kg Drum

Sylgard® Q33600 is a Thermally conductive encapsulant for highvoltage transformers.

20 kg Drum

Sylgard® 164 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

210 ml Kit

Sylgard® 164 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

24.9 kg Drum B

Sylgard® 164 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

226.7 kg Drum B

Sylgard® 164 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

24.9 kg Drum A

Sylgard® 164 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

226.7 kg Drum A

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

5.4 kg Drum B

Sylgard® 160 is used for General encapsulating or potting applications such as power supplies, connectors, sensors, transformers, amplifiers, relays.

24.9 kg Drum B

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