Encapsulants 

Standard filled encapsulants provide thermal conductivity and have low viscosity for rapid part filling without bubbles. 

Encapsulants allow heat to be removed from components to metal housings, which serve as heat sinks.

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ManufacturerNameApplicationPackaging

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

250 g Bag

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

25 kg Kit

Polyurethane resin specially engineered for encapsulating and potting electrical and electronic devices operating in harsh conditions such as marine, tropical and automotive environments.

5 kg Kit

Epoxy resin for encapsulation and potting of PCBs, electrical connections, transformers and thermal collectors.

250 g Bag

Epoxy resin for encapsulating and potting ABS brake sensors, temperature sensors, gates and power supplies.

500 g Bag

Epoxy resin for encapsulating and potting ABS brake sensors, temperature sensors, gates and power supplies.

250 g Bag

Epoxy resin for encapsulating and potting ABS brake sensors, temperature sensors, gates and power supplies.

5 kg Kit

Epoxy resin for encapsulating and potting ABS brake sensors, temperature sensors, gates and power supplies.

25 kg Kit

Epoxy resin for encapsulation and potting of PCBs, electrical connections, transformers and thermal collectors.

250 g Bag

Epoxy resin for encapsulation and potting of PCBs, electrical connections, transformers and thermal collectors.

5 kg Kit

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