Heat-transfer compound 

Easy to use and non-curing, compounds are used for applications that require high thermal conductivity. They have low thermal resistance and are easy to remove for maintenance.

They require mechanical fastening to maintain their thickness, which is generally less than 50 microns.

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ManufacturerNameApplicationPackaging

Thermally Conductive Silicone Compound with a thermal conductivity of 3 W/m.K, for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal...

50 ml Tube

Thermally Conductive Silicone Compound with a thermal conductivity of 3 W/m.K, for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal...

20 kg Drum

Thermally Conductive Silicone Compound with a thermal conductivity of 3 W/m.K, for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal...

10 kg Drum

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

700 g Cartridge

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

35 ml syringe

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

20 kg Drum

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

2 ml Seringe

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

10 ml Seringe

Thermally Conductive Silicone Compound with a thermal conductivity of 0.9 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

1 kg Tin

Thermally Conductive nonsilicone compound with a thermal conductivity of 1.35 W/m.K, recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required.

700 g Cartridge

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