Thermal adhesive 

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ManufacturerNameApplicationPackaging

Acrylic adhesive on both sides with a thermal conductivity of 1,4 W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 300mmx50m or custom die-cut parts available.

Acrylic adhesive on both sides with a thermal conductivity of 1,3 W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 1mx50m or custom die-cut parts available.

Acrylic adhesive on both sides with a thermal conductivity of 1,2W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 1mx50m or custom die-cut parts available.

Acrylic adhesive on both sides with a thermal conductivity of 1 W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 400mmx25m or custom die-cut parts available.

Acrylic adhesive on both sides with a thermal conductivity of 1W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 500mmx100m or custom die-cut parts available.

Silicone adhesive on both sides on Kapton tape with a thermal conductivity of 0,6W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 406,4mmx16,45m / 25,4mmx16,45m or custom die-cut parts available.

Silicone adhesive on both sides on Kapton tape with a thermal conductivity of 0,4W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 406,4mmx16,45m / 25,4mmx16,45m or custom die-cut parts available.

Le PC 3001 est un thermodurcissable mono composant, adhésif conducteur époxy chargé d'argent sans solvant conçu pour la connexion entre les composants (SMD) et matrices nues en LTCC et substrats en céramique

Seringue de 40g S2