Gap filler 

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DOWSIL™ TC4525, formerly DOW CORNING™ TC4525, is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a...

20 oz cartridge (3.2kg)

DOWSIL™ TC4525, formerly DOW CORNING™ TC4525 is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal...

40 kg Kit

DOWSIL™ TC4525GB, formerly DOW CORNING™ TC4525GB is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a...

20 oz cartridge (3.2kg)

DOWSIL™ TC4525GB, formerly DOW CORNING™ TC4525GB is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a...

40 kg Kit

DOWSIL™ TC4515 formerly DOW CORNING® TC4515, is a thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal...

20 oz cartridge (3.2kg)

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 1.5W/m.K

40 kg Kit

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 1.5W/m.K with glass bead to help...

20 oz cartridge (3.2kg)

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 1.5W/m.K with glass bead to help...

40 kg Kit

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 3,4W/m.K with glass bead to help...

50 ml cartridge

Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink via a thermal conductivity of 3,4W/m.K with glass bead to help...

2 kg kit

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