One-part silicones 

Engineered for very-low-temperature applications or microelectronics solutions such as glob-top or dam and fill. They are also available as UV-cure gels.

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ManufacturerNameApplicationPackaging

Encapsulant for microelectronics.

170g Cartridge

Encapsulant for microelectronics.

Bottle 1kg

Gel encapsulant for applications that need to be fuel and solvent resistant.

740 g Cartridge

DOWSIL™ 36635 formerly DOW CORNING® 36635, is used for very low temperature applications.

181.4 kg Drum

DOWSIL™ 36635 formerly DOW CORNING® 36635, is used for very low temperature applications.

3.6 kg Drum

DOWSIL™ 36635 formerly DOW CORNING® 36635, is used for very low temperature applications.

18.1 kg Drum

UV curable gel encapsulant (potting).

181.4 kg Drum

DOWSIL™ X36211 formerly DOW CORNING® X36211, is an UV curable gel encapsulant (potting).

3.6 kg Drum

Sylgard® 537 is an encapsulating or potting Gel

210 ml cartridge

Sylgard® 537 is an encapsulating or potting Gel

17.5 kg Drum

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