Kapton tapes 

During wave soldering, all PCB components (through-hole and SMC) and all plated sections (vias) are either soldered or sealed.
Some components, such as lands, cannot withstand this step due to mechanical, thermal or other reasons. 

They must therefore be masked and soldered at a later time.
This masking can be done using peelable coating mask synthetic (Electrolube® PCS) and a new product: Kapton®.

EP25 and EP50 are high-temperature tapes made from Kapton® HN film with silicone adhesive.
They are available in widths of 6, 9, 12, 13, 15, 19, 25, 38 and 50 mm and up to 960 mm.

Each roll is 33 meters (108 feet) long and comes in two backing thicknesses (25 µm and 50 µm).

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ManufacturerNameApplicationPackaging

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

9 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

6 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

50 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

38 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

25 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

19 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

15 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

13 mm Width

TECNITE EP50K is used in temporary masking processes, in wave soldering. TECNITE EP50K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

12 mm Width

TECNITE EP25K is used in temporary masking processes, in wave soldering. TECNITE EP25K is applied to different electronic substrates such as aluminum, epoxy FR4 (PCBs), ceramic, etc.

9 mm Width

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