En savoir plus

Saint-Gobain

ManufacturerNameApplicationPackaging

Silicone adhesive on both sides on Kapton tape with a thermal conductivity of 0,6W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 406,4mmx16,45m / 25,4mmx16,45m or custom die-cut parts available.

Silicone adhesive on both sides on Kapton tape with a thermal conductivity of 0,4W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 406,4mmx16,45m / 25,4mmx16,45m or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 1,3W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 457x914mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 1,6W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 609,6x609,6mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 1,1W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 609,6x609,6mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 3W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 609,6x609,6mm or custom die-cut parts available.


Notice: Undefined index: cookie_accept in /home/samaro/public_html/tools/smarty/sysplugins/smarty_internal_templatebase.php(157) : eval()'d code on line 51

En poursuivant votre navigation sur ce site, vous acceptez l’utilisation de cookies pour réaliser des statistiques de visites

Pour en savoir plus et paramétrer les traceurs