Silicone bicomposant 

Mastic silicone à polymérisation neutre (pour une compatibilité avec les composants électroniques), à température ambiante (RTV) ou à chaud, pâteux ou fluide, Samaro vous propose de nombreux produits dédiés au collage ou à l'étanchéité adaptés à votre besoin.

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ManufacturerNameApplicationPackaging

DOWSIL™ 96083 formerly DOW CORNING® 96083, is an fixing components, bonding to various substrates such as ceramics, plastics, glass and metals.

3.9 kg Kit

Bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors. Suitable for deep sections or confined cures.

400 kg Kit

Bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors. Suitable for deep sections or confined cures.

40 kg Kit

DOWSIL™ Q58401 formerly DOW CORNING® Q58401, is used for bonding and sealing lids and housings, attaching base plates, sealing connectors and sensors. Suitable for deep sections or confined cures.

210 ml Kit

Bonding microprocessors to heat sinks.

40 kg Kit

Bonding microprocessors to heat sinks.

4 kg Kit

DOWSIL™ Q19226 formerly DOW CORNING® Q19226, is used for bonding microprocessors to heat sinks.

210 ml Kit

DOWSIL™ Q19226 formerly DOW CORNING® Q19226, is used for bonding microprocessors to heat sinks.

2 kg Kit

DOWSIL™ Q19226 formerly DOW CORNING® Q19226, is used for bonding microprocessors to heat sinks.

16 kg Kit

DOWSIL™ Q19225 formerly DOW CORNING® Q19225, is used for bonding ceramic condensers and other electronic components.

1.1 kg kit

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