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Silicone Thermal pad with a thermal conductivity of 1,2W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 1,5W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 2W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm / 330x330mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 2,5W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm / 330x330mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 3W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm / 330x330mm or custom die-cut parts available.

Silicone Thermal pad with a thermal conductivity of 5W/m.K for energy converter, computer memory chips, telecommunications applications.

Standard parts : 200x400mm or custom die-cut parts available.

Silicone interface with a thermal conductivity of 1,8W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 300mmx50m or custom die-cut parts available.

Silicone interface with a thermal conductivity of 0,8W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 300mmx50m or custom die-cut parts available.

Silicone interface with a thermal conductivity of 0,8W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 300mmx50m or custom die-cut parts available.

Silicone interface with a thermal conductivity of 0,8W/m.K for energy converter, computer memory chips, telecommunications applications.

Roll : 300mmx50m or custom die-cut parts available.


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